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Linear and angle encoders

EMPOWER TECHNOLOGY

Higher performance for the semiconductor and electronics industry

BACK-END ASSEMBLY

Solutions from HEIDENHAIN and RSF for greater performance in wire bonding and die bonding applications

MULTI-DOF TECHNOLOGY boosts productivity

Encoders that measure up to six degrees of freedom

HIGH-END MOTION SYSTEMS

ETEL stages for greater accuracy and performance in the semiconductor and electronics industry

LINEAR & ANGLE ENCODERS

Highly accurate, compact, and application-tailored encoders from HEIDENHAIN, NUMERIK JENA, and RSF

TRANSFERABLE ACCURACY

Realize your encoder's full accuracy benefits in the application with the MRP 8000 angle encoder module, featuring four scanning heads.

Empower Technology
Higher performance for the semiconductor and electronics industry

The HEIDENHAIN GROUP is your partner for solutions
combining precision, dynamic performance, practical value, and reliability.

Join us in breaking the accuracy barrier.
Discover our pioneering innovations
that unlock the N+1 process node.


Digital SEMICON EVENT: October 27 to 31 and November 10 to 14, 2025

Schedule a live session to find out more! Let us help you find a solution tailored to your needs

MULTI-DOF technology for positioning accuracy better than 200 nm

The accuracy of production equipment plays a vital role in the performance of the manufactured components, especially in the electronics and semiconductor manufacturing industry. The memory and computing capacity of today’s computer chips depend on ever greater accuracy in front-end and downstream back-end production processes, including hybrid bonding and advanced packaging.

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Advanced Packaging

Discover higher accuracy and productivity: MULTI-DOF TECHNOLOGY from HEIDENHAIN and the latest stage from ETEL, the TELICA HP, featuring ACCURET+ position control and the QUIET active isolation system, are unlocking new dimensions for hybrid bonding, thermocompression bonding, and fan-out applications.

High-end Automation

Unleash dynamic performance and accuracy for axis positioning in laser applications with galvo scanners and more. Encoders from HEIDENHAIN, NUMERIK JENA, and RSF, as well as motion systems from ETEL, offer versatile solutions for every application, including applications with very limited installation space.

Back-end Assembly

Accelerate your production and inspection processes: The HEIDENHAIN GROUP offers optimal solutions for high-performance wire bonding and die bonding processes, providing linear and angle encoders from HEIDENHAIN, NUMERIK JENA, and RSF, as well as handling solutions from ETEL.

Metrology & Inspection

High-accuracy processes require machines with high-precision motion at the tool center point. We offer tools for determining the accuracy of your machines, allowing you to inspect and recalibrate them. Ensure optimal results by compensating for thermal drift and Abbé errors.

WINGLET Software

How can you easily optimize highly complex motion systems? With the WINGLET software developed by ETEL. Whether during initial setup or for testing and readjustment when used in facilities for the production of semiconductors and electronic components, it ensures a perfect system setup for maximum performance.

CHARON2 HD and Z3TM+ 

Greater productivity and a higher degree of accuracy are made possible by the interplay of the highly dynamic CHARON2 HD motion system and the Z3TM+ module. This combination delivers motion control in six degrees of freedom and a special lifting mechanism for easier wafer handling.

Enter a new dimension of accuracy with encoders that measure up to six degrees of freedom

Discover encoders that measure more than a single degree of freedom, including the LIP 6000 Dplus and the new GAP 1000. The additional feedback from their MULTI-DOF TECHNOLOGY results in far greater measurement accuracy, letting you detect and compensate for system-relevant positional error in multiple dimensions.

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PP 6000: two measuring directions for greater accuracy

Abbé errors have a negative effect on machine tool accuracy. Measuring them is normally difficult, but not with the PP 6000 two-coordinate encoder. Using a single scanning head, this encoder measures two directions simultaneously across a 464 mm x 464 mm field, with larger fields available upon request. By measuring the tool center point directly, it allows you to minimize Abbé errors and improve the accuracy of your machine. Its dual position feedback is transmitted over a single cable using the EnDat 3 interface, thereby reducing your cabling and setup work. Optimize the dynamic behavior of your motion system with the PP 6000.

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New

LIP 6000 Dplus: one scale, one scanning head and two degrees of freedom

The LIP 6000 Dplus uses a single scale with two separate graduations angled diagonally at +45° and –45°. A special scanning head with a scanning field for each graduation measures the primary direction X and the secondary direction Y along the entire measuring length. Thanks to the EnDat 3 interface, this dual position feedback is sent to the control via a single cable. This significantly reduces cabling, simplifies installation, and optimizes the motion system’s dynamic performance.

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The easy way to check your machine’s accuracy: our calibration tool based on the LIP 6000 Dplus

Inspect and adjust your machine anytime using our calibration tool based on the LIP 6000 Dplus. Calibrating your machines isn’t a daily event, so you can also rent our tool as a HEIDENHAIN service without needing to purchase and maintain one of your own. Our certified calibration tool is a convenient way to check the accuracy of your systems on an as-needed basis.

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New

GAP 1081: out-of-plane gap measurement

The new GAP 1081 is the first gap encoder from HEIDENHAIN. It measures the vertical gap between a special mirror and the encoder's scanning head. The GAP 1081 can be used for vertical positioning tasks, or it can be installed parallel to a linear encoder, such as the LIP 6000 Dplus, for continuous vertical measurement along a linear axis. Mirrors for the GAP 1081 are available in lengths of up to 3 m. And if two scanning heads are used on a single mirror, then both the pitch and yaw of the axis can be measured.

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Where accuracy meets throughput:
discover new solutions for electronics and semiconductor manufacturing
at the HEIDENHAIN Semiconductor Event 2025.

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Heavy-duty axes: unfazed by cogging torques or radial forces

The combination of an MRP angle encoder module from HEIDENHAIN and a torque motor from ETEL enables exceptionally smooth motion control. Neither disruptive cogging torques nor radial forces impair the bearing’s high guideway accuracy. Also available are the SRP 5000 angle encoder modules, highly compact systems featuring a low profile and high rigidity. The high rigidity of their components also ensures consistent accuracy under varying loads.

Specs and product variants

Exposed HEIDENHAIN encoders for dynamic rotary axes: the ERO 2000 and, now with MULTI-DOF TECHNOLOGY, the ERP 1080 Dplus

Electronics and semiconductor manufacturing is a dynamic industry. HEIDENHAIN accounts for its rapid pace of change through continual development of its exposed encoders. This has given rise to the ERO 2000 incremental angle encoder, designed specifically for tight spaces and high dynamic performance requirements, as found in Galvanometer optical scanners. There is also the ERP 1000, with its very high accuracy and resolution. And one of its variants, the ERP 1080 Dplus, featuring four scanning heads, delivers the same robustness and installation benefits as the MRP 8081 Dplus angle encoder module.

ERO 2000: more info and variants ERP 1000: a wide selection

Our media library: informative and entertaining

Watch our product specialist videos and technology animations for a quick overview of our highlights for the semiconductor and electronics industry, including solutions from HEIDENHAIN, ETEL, NUMERIK JENA, and RSF.

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Curious about more solutions for semiconductor and electronics manufacturing?

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