Virtual show | SEMICONDUCTORS & ELECTRONICS

Mastering back-end assembly processes

Back-end chip manufacturing processes require extremely fast production and inspection combined with force control and process reliability.

Encoders from the HEIDENHAIN GROUP and handling systems from ETEL are unlocking new dimensions
in accuracy, dynamic performance, force control, and reliability for your applications:

IC handlers, wire bonders, die sorters, die bonders, wafer dicers, and wafer probers

HEIDENHAIN at SEMICON: Empower Technology

The HEIDENHAIN GROUP is your partner for solutions
combining precision, dynamic performance, practical value, and reliability.

Join us in breaking the accuracy barrier.
Discover our pioneering innovations
that unlock the N+1 process node.

SEMICON West: October 7 to 9, 2025
Digital SEMICON EVENT: October 27 to 31 and November 10 to 14, 2025

High-speed handling from ETEL
for very thin to large components

RTMB+, TUCANA ST und AQUARIUS ST: new horizons in die and wafer handling

Motion systems for rotary axes: Turret handling with high dynamic performance

The DG 14 from RSF: Z-axis encoder for bonders

The DG 14 incremental angle encoder from RSF is designed to track highly dynamic motion in extremely tight spaces. Designed as a modular system, the DG 14 consists only of a compact scanning head and a circular scale segment. The segment’s length and graduation period can be adapted to the requirements of the given application, thereby enabling optimally designed wire bonder heads in terms of size and accuracy.

Ultra-flat linear encoders: LIKgo and LIKselect from NUMERIK JENA

The LIKgo and LIKselect exposed linear encoders from NUMERIK JENA are ideal for tight installation spaces and high accuracy requirements.

The standard model, the LIKgo, is particularly small and lightweight. Its scanning head is a mere 28 mm x 13 mm x 7.5 mm in size and weighs only 10 g. The encoder’s newly developed two-field scanning method with a 20 µm grating period and measuring steps of down to 78.125 nm is extremely precise, delivers high signal quality, and is resistant to contamination.

For customized designs, the LIKselect encoders combine these benefits with the strengths of the Kit L series from NUMERIK JENA, giving you highly configurable encoders for your individual requirements.

LIC 3000: exposed encoder from HEIDENHAIN for highly dynamic linear axes

The LIC 3000 series is joining the familiar series of LIC 4000 and LIC 2000 exposed absolute linear encoders. The LIC 3000 combines very small measuring steps of just 10 nm with traversing speeds of up to 600 m/min. The LIC 3000 linear encoders enable highly dynamic and precise position measurement on linear axes with measuring lengths of up to 10 m.

A large scanning field makes the LIC 3000 highly resistant to contamination. Localized impurities on the measuring standard have minimal effect on the signal quality and measurement reliability. Thanks to their dynamic performance, long measuring lengths, and robustness, the exposed linear encoders of the LIC 3000 series are particularly versatile, bringing the advantages of LIC encoders to even more applications.

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