Back-end Assembly

Virtual show | SEMICONDUCTORS & ELECTRONICS

Mastering back-end assembly processes

Back-end chip manufacturing processes require extremely fast production and inspection combined with force control and process reliability.

Encoders from the HEIDENHAIN GROUP and handling systems from ETEL are unlocking new dimensions
in accuracy, dynamic performance, force control, and reliability for your applications:

IC handlers, wire bonders, die sorters, die bonders, wafer dicers, and wafer probers

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Empower Technology
Higher performance for the semiconductor and electronics industry

The HEIDENHAIN CORPORATE GROUP is your partner for solutions
combining precision, dynamic performance, practical value, and reliability.

Join us in breaking the accuracy barrier.
Discover our pioneering innovations
that unlock the N+1 process node.

SEMICON EUROPE: November 10 to 13, 2026, Messe München, C2.355

Let us help you find a solution tailored to your needs

High-speed handling from ETEL
for very thin to large components

RTMB+, TUCANA ST und AQUARIUS ST: new horizons in die and wafer handling

Motion systems for rotary axes: Turret handling with high dynamic performance

The DG 14 from RSF: Z-axis encoder for bonders

The DG 14 incremental angle encoder from RSF is designed to track highly dynamic motion in extremely tight spaces. Designed as a modular system, the DG 14 consists only of a compact scanning head and a circular scale segment. The segment’s length and graduation period can be adapted to the requirements of the given application, thereby enabling optimally designed wire bonder heads in terms of size and accuracy.

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Versatile modular encoders for your customized solution

If you value maximum versatility for integrating linear and angle encoders, then you need the modular solutions from RSF. Select from a wide variety of physical designs and interfaces to all common controllers, and benefit from wide mounting tolerances and easy installation.

Linear and angular encoders from RSF

The MCR 15 (absolute) and MSR 15 (incremental) modular angle encoders with a scale drum (outer diameter: 50 mm to 350 mm) provide speed and position feedback
The MC 15 is an absolute exposed linear encoder for high-accuracy positioning (measuring length: up to 10 000 mm, measuring step: down to 50 nm)
The MS 15 is a modular exposed linear encoder with a variety of graduation carriers (length: up to 20 000 mm) and scanning heads (measuring step: from 10 µm to 50 nm) for perfect customization, including integrated optical homing and limit functions.
The MS 14 is an exposed linear encoder featuring single-field scanning. Thanks to its online signal stabilization functionality and built-in, three-colored LED signal quality indicator, the MS 14 enables continuous monitoring of its scanning signal across the encoder’s measuring length of up to 10 000 mm. At the same time, it offers measuring steps ranging from 10 µm down to 50 nm and high travel speeds of 10 m/s.

Ultra-flat linear encoders: LIKgo and LIKselect from NUMERIK JENA

The LIKgo and LIKselect exposed linear encoders from NUMERIK JENA are ideal for tight installation spaces and high accuracy requirements.

The standard model, the LIKgo, is particularly small and lightweight. Its scanning head is a mere 28 mm x 13 mm x 7.5 mm in size and weighs only 10 g. The encoder’s newly developed two-field scanning method with a 20 µm grating period and measuring steps of down to 78.125 nm is extremely precise, delivers high signal quality, and is resistant to contamination.

For customized designs, the LIKselect encoders combine these benefits with the strengths of the Kit L series from NUMERIK JENA, giving you highly configurable encoders for your individual requirements.

The new LIK generation from NUMERIK JENA

LIC 3000: exposed encoder from HEIDENHAIN for highly dynamic linear axes

The LIC 3000 series is joining the familiar series of LIC 4000 and LIC 2000 exposed absolute linear encoders. The LIC 3000 combines very small measuring steps of just 10 nm with traversing speeds of up to 600 m/min. The LIC 3000 linear encoders enable highly dynamic and precise position measurement on linear axes with measuring lengths of up to 10 m.

A large scanning field makes the LIC 3000 highly resistant to contamination. Localized impurities on the measuring standard have minimal effect on the signal quality and measurement reliability. Thanks to their dynamic performance, long measuring lengths, and robustness, the exposed linear encoders of the LIC 3000 series are particularly versatile, bringing the advantages of LIC encoders to even more applications.

Find out more about the LIC 3100 series

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