Virtual show
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SEMICONDUCTORS & ELECTRONICS
Higher accuracy and productivity for advanced packaging
HEIDENHAIN encoders and ETEL motion systems unlock new dimensions in state-of-the-art advanced packaging technologies, including hybrid bonding, thermocompression bonding, and fan-out applications:
Nanometer-accuracy positioning
Innovative motion control
Vibration monitoring
Empower Technology
Higher performance for the semiconductor and electronics industry
The HEIDENHAIN CORPORATE GROUP is your partner for solutions
combining precision, dynamic performance, practical value, and reliability.
Join us in breaking the accuracy barrier.
Discover our pioneering innovations
that unlock the N+1 process node.
SEMICON EUROPE: November 10 to 13, 2026, Messe München, C2.355



